New Issue Of Securities (Chapter 6 Of Listing Requirements) : Fund Raising
BackFeb 28, 2025
| Type | Announcement |
| Subject | NEW ISSUE OF SECURITIES (CHAPTER 6 OF LISTING REQUIREMENTS) FUND RAISING |
| Description | LEFORM BERHAD ("LEFORM" OR THE "COMPANY") PROPOSED PRIVATE PLACEMENT OF UP TO 10% OF THE TOTAL NUMBER OF ISSUED SHARES OF LEFORM PURSUANT TO SECTIONS 75 AND 76 OF THE COMPANIES ACT 2016 ("PROPOSED PRIVATE PLACEMENT") |
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On behalf of the Board of Directors of Leform ("Board"), UOB Kay Hian Securities (M) Sdn Bhd ("UOBKH") wishes to announce that the Company proposes to undertake a private placement of up to 10% of the total number of issued shares in Leform ("Leform Share(s)" or "Share(s)") (excluding treasury shares, if any) to third party investor(s) to be identified later, at an issue price to be determined and announced later, in accordance with Sections 75 and 76 of the Companies Act 2016 ("Act"). Further details of the Proposed Private Placement are set out in the attachment enclosed.
This announcement is dated 28 February 2025.
Please refer attachment below. |
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Announcement Info
| Company Name | LEFORM BERHAD |
| Stock Name | LEFORM |
| Date Announced | 28 Feb 2025 |
| Category | General Announcement for PLC |
| Reference Number | GA1-28022025-00091 |
Attachments
- Leform_PP_Announcement_20250228.pdf (Size: 231,379 bytes)